Besi flip Chip Bonder
「Besi flip Chip Bonder」熱門搜尋資訊
「Besi flip Chip Bonder」文章包含有：「Datacon2200evo」、「Datacon8800FCQUANTUMadvanced」、「Datacon8800FCQUANTUMhS」、「Datacon8800TCadvanced」、「DieAttach」、「DieBonding」、「Esec2100FChS」、「FlipChip」
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Datacon 2200 evo
https://www.besi.com
The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications.
Datacon 8800 FC QUANTUM advanced
https://www.besi.com
... Flip Chip system available today. Highest UPH up to 9000, including dip fluxing; Full process and yield control; Proven 5µm accuracy. Key Features ...
Datacon 8800 FC QUANTUM hS
https://www.besi.com
- Versatile High Speed Flip Chip Bonder - Unique Quattro Concept - Accuracy ± 4μm @ 3σ - UPH up to 16,000. A Datacon QUANTUM system for your product. Seeing ...
Datacon 8800 TC advanced
https://www.besi.com
Flip chip unit, Pick-up of the component from wafer, 180° rotation of the flip arm and presentation to the bond head. Wafer pre-rotation, 0° - 280°. Slide ...
Die Attach
https://www.besi.com
The offering includes multi-chip bonders for advanced packaging, epoxy and soft solder bonders, high precision flip chip bonders for mass production, stacked ...
Die Bonding
https://www.besi.com
The Die Bonder Esec 2100 hS is the 3rd generation of the most flexible 300 mm high speed platform, capable of running an extensive range of epoxy die attach ...
Esec 2100 FC hS
https://www.besi.com
The Flip Chip Bonder Esec 2100 FC hS is the 3rd generation of the market leading High Speed FC platform, capable of running an extensive range of FC ...
Flip Chip
https://www.besi.com
Besi offers flip chip systems for mass production as well as for the high-end sector, covering a wide range of flip chip processes. Datacon 8800 FC QUANTUM.